NBD 7163K、uv解黏膠帶、UV Tape在PTT/mobile01評價與討論，在ptt社群跟網路上大家這樣說
NBD 7163K關鍵字相關的推薦文章
NBD 7163K在What is UV Tape ?｜Tape for Semiconductor Process的討論與評價
UV Tape is adhesive tape for semiconductor process. It is suitable to protect surface of semiconductor wafer during backgrinding process, ...
NBD 7163K在UV 解黏膠帶、UV 切割膠帶 - 好加企業股份有限公司的討論與評價
近年來UV解黏膠帶，儼然成為半導體業界重頭戲，如何縮短製程時間，讓生產力提升，亦是好加企業持續開發新產品的重點。
NBD 7163K在GDT series - 鉅侖科技GILLION的討論與評價
UV tape, UV release tape. ... Adhesion of the tapes can be substantially decreased with UV irradiation, allowing easy peeling without stress on the compound ...
NBD 7163K在ptt上的文章推薦目錄
NBD 7163K在UV Curable Dicing Tape的討論與評價
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. SPECIFICATIONS. P/N 24216 UE-2091J Extra High ...
NBD 7163K在UV Release Tape - NanYa Functional Films的討論與評價
UV Release Tape. UV curable adhesive coats on PET or PO film with adhesion500-2500g. After UV treated, it goes below 30g and can be customized.
NBD 7163K在Dicing tape - Wikipedia的討論與評價
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or ...
NBD 7163K在半導體產業用UV膠帶發展與市場資訊 - 材料世界網的討論與評價
紫外線可硬化膠帶（UV膠帶；UV Tape）是感壓膠帶的一種，其結構如圖一所示，主要在基材上塗佈一層黏著劑所構成。其所使用的基材為塑膠薄膜，常見的基材有 ...
NBD 7163K在Dicing Tape (UV, high temperature) - S3 Alliance的討論與評價
The conventional dicing tapes (our product; HUV-S3000 series etc.) do not have heat resistance. – There is no heat-resistance in UV curable adhesive .When UV ...
NBD 7163K在Wafer Dicing Tapes - AI Technology, Inc.的討論與評價
Release -on-demand by exposure to UV irradiation to enable pick up of largest of dies. · Low ionic impurities and doesn't impart contamination of metal ions from ...
NBD 7163K在Dicing and Grinding Tapes - High Temperature and UV ...的討論與評價
Dicing and Grinding Tapes - High Temperature and UV Release Tapes ... AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure.